Samuel K. Moore
IEEE Spectrum
New York, NY, United States
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Past articles by Samuel:
The Secret to Nvidia's Success
Chief scientist Bill Dally explains the 4 ingredients that brought Nvidia so far → Read More
Linking Chips With Light For Faster AI
IEEE Spectrum's semiconductor expert Samuel K. Moore and the race to put fiber optics inside computers → Read More
Object Recognition Has an Income Problem
Object recognition neural networks are only as good as the data they’re trained on. And that data is heavy on images from high-income countries in Europe and North America. So, when confronted with everyday items from lower-income countries, they get it right as litte as 20 percent of the time. → Read More
Intel’s Take on the Next Wave of Moore’s Law
Ann B. Kelleher explains what's new 75 years after the transistor's invention → Read More
The Transistor at 75
The past, present, and future of the modern world’s most important invention → Read More
The State of the Transistor in 3 Charts
In 75 years, it’s become tiny, mighty, ubiquitous, and just plain weird → Read More
New Records for the Biggest and Smallest AI Computers
Nvidia H100 and Intel Sapphire Rapids Xeon debut on ML Perf training benchmarks → Read More
Linking Chiplets Just Got a Lot Easier
The most advanced processors today are no longer a single piece of silicon. Instead they are multiple “chiplets” bound together by advanced packaging techniques that do their best to make it seem as if everything really is one big chip. But this startup's new interconnect tech might change the game. → Read More
Chip Fabs Go Green
A new consortium of fabs and suppliers wants the semiconductor industry to cut its carbon footprint → Read More
First Nvidia Hopper Benchmark Tests and Other AI Milestones
Newest MLPerf inferencing results include tests of new chips, slimmed down neural networks, and more → Read More
AI Is Learning Twice as Fast This Year Than Last
According to the best measures we’ve got, a set of benchmarks called MLPerf, machine learning systems can be trained nearly twice as quickly they could last year. It’s a figure that outstrips Moore’s Law by quite a ways. → Read More
AI Is Learning Twice as Fast This Year Than Last
According to the best measures we’ve got, a set of benchmarks called MLPerf, machine learning systems can be trained nearly twice as quickly they could last year. It’s a figure that outstrips Moore’s Law by quite a ways. → Read More
The First High-Yield, Sub-Penny Plastic Processor
It took a major redesign for cheap flexible chips to reach their promise → Read More
“PACMAN” Hack Can Break Apple M1’s Last Line of Defense
How many dominos could fall if this centerpiece CPU’s weakness pans out? → Read More
Nvidia’s Next GPU Shows That Transformers Are Transforming AI
Transformers, the type of neural network behind OpenAI's GPT-3 and other big natural language processors, are quickly becoming some of the most important in industry—and likely to spread to other areas of AI. Nvidia's new Hopper H100 is proof that the AI accelerator maker is a believer. → Read More
Samsung and Omnivision Claim Smallest Camera Pixels
Last month, two companies said they have reached the next stage in shrinking the pixels on CMOS camera chips. Both Santa Clara-based Omnivision and South Korea's Samsung claimed pixels with a pitch of just 0.56 micrometers. → Read More
Samsung and Omnivision Claim Smallest Camera Pixels
Last month, two companies said they have reached the next stage in shrinking the pixels on CMOS camera chips. Both Santa Clara-based Omnivision and South Korea's Samsung claimed pixels with a pitch of just 0.56 micrometers. → Read More
Graphcore Uses TSMC 3D Chip Tech to Speed AI by 40%
UK-based AI computer company Graphcore made a significant boost to its computers' performance without changing much of anything about its specialized AI processor cores. The secret is TSMC's wafer-on-wafer 3D integration technology. → Read More
Graphcore Uses TSMC 3D Chip Tech to Speed AI by 40%
UK-based AI computer company Graphcore made a significant boost to its computers' performance without changing much of anything about its specialized AI processor cores. The secret is TSMC's wafer-on-wafer 3D integration technology. → Read More
Behind Intel’s HPC Chip that Will Pierce the Exascale Barrier
On Monday, Intel unveiled new details of the processor that will power the Aurora supercomputer, which is designed to become the one of the first U.S.-based machine to pierce the exaflop barrier—a billion billion high-precision floating point calculating per second. → Read More